In the early stage of the development of IC lead frame plating, the products are generally all gold-plated, but with the increase in the market demand for lead frames, the cost of full gold plating is so high that many small and medium-sized companies are unacceptable.

In the early 1970s, some companies began to use full silver plating technology instead of gold plating, in the late 1970s, some Japanese companies began to use partial silver plating. That is selective plating.Because this method can save precious metals, it is widely used in the semiconductor material industry and has developed rapidly, and has continued to the present.

In the early stage of the development of selective electroplating. Only one end of the product with a specific structure can be electroplated, and it is difficult to do when only the middle position needs to be electroplated. In the later stage with the maturity of high-speed electroplating technology and process, special masks began to be used for electroplating in different areas, that is selective plating tool.

In this way, the plating area becomes flexible. As long as the corresponding holes are designed on the mold and the plating solution is sprayed out, effective plating can be performed.

After nearly 30 years of development, selective electroplating technology has been widely used in the IC material industry. At the same time, a group of professional companies integrating design, development and production of electroplating equipment have emerged.

SPC Precision is a reliable supplier of PEEK plating tool solutions.